| Kapasitas papan kaku | |
| Jumlah lapisan: | 1-42 lapisan |
| Bahan: | FR4\high TG FR4\Lead free material\CEM1\CEM3\Aluminium\Metal core\PTFE\Rogers |
| Ketebalan lapisan Cu: | 1-6OZ |
| Lapisan jero Cu ketebalan: | 1-4OZ |
| Wewengkon ngolah maksimum: | 610 * 1100mm |
| Ketebalan papan minimum: | 2 lapisan 0.3mm (12mil) |
| 4 lapisan 0.4mm (16mil) | |
| 6 lapisan 0.8mm (32mil) | |
| 8 lapisan 1.0mm (40mil) | |
| 10 lapisan 1.1mm (44mil) | |
| 12 lapisan 1.3mm (52mil) | |
| 14 lapisan 1.5mm (59mil) | |
| 16 lapisan 1.6mm (63mil) | |
| Lebar minimum: | 0,076 mm (3 mil) |
| Spasi Minimum: | 0,076 mm (3 mil) |
| Ukuran liang minimum (liang ahir): | 0,2 mm |
| Babandingan aspék: | 10:01 |
| Ukuran liang pangeboran: | 0,2-0,65 mm |
| Toleransi pangeboran: | +\-0.05mm(2mil) |
| Toleransi PTH: | Φ0.2-1.6mm +\-0.075mm (3mil) |
| Φ1.6-6.3mm+\-0.1mm(4mil) | |
| kasabaran NPTH: | Φ0.2-1.6mm +\-0.05mm(2mil) |
| Φ1.6-6.3mm+\-0.05mm(2mil) | |
| Réngsé papan toleransi: | Ketebalan <0.8mm, Kasabaran: +/-0.08mm |
| 0.8mm≤Thickness≤6.5mm,Toleransi +/-10% | |
| Sasak soldermask minimum: | 0,076 mm (3 mil) |
| Ngagulung sareng ngagulung: | ≤0.75% Min0.5% |
| Raneg tina TG: | 130-215 ℃ |
| kasabaran impedansi: | +/-10%，Min+/-5% |
| Perlakuan permukaan: | HASL, LF HASL |
| Immersion Emas, Flash Emas, ramo Emas | |
| Immersion Silver, Immersion Tin, OSP | |
| Selektif Emas Plating, ketebalan Emas nepi ka 3um (120u") | |
| Carbon Print, Peelable S/M, ENEPIG | |
| kapasitas dewan aluminium | |
| Jumlah lapisan: | Lapisan tunggal, lapisan ganda |
| Ukuran papan maksimum: | 1500 * 600mm |
| Ketebalan papan: | 0,5-3,0 mm |
| Ketebalan tambaga: | 0,5-4oz |
| Ukuran liang minimum: | 0,8 mm |
| lebar minimum: | 0,1 mm |
| spasi minimum: | 0,12 mm |
| Ukuran pad minimum: | 10 mikron |
| Permukaan rengse: | HASL, OSP, ENIG |
| Wangun: | CNC, Punching, V-cut |
| Parabot: | Universal Tester |
| Ngalayang usik Buka / Tester pondok | |
| Mikroskop kakuatan tinggi | |
| Kit Tés Solderability | |
| Tester Kakuatan mesek | |
| High Volt Buka & Short tester | |
| Cross Bagian Molding Kit Jeung Polisher | |
| Kapasitas FPC | |
| Lapisan: | 1-8 lapisan |
| Ketebalan papan: | 0,05-0,5 mm |
| Ketebalan tambaga: | 0.5-3OZ |
| Lebar minimum: | 0,075 mm |
| spasi minimum: | 0,075 mm |
| Ukuran liang dina: | 0,2 mm |
| Ukuran minimum liang laser: | 0,075 mm |
| Ukuran minimum punching hole: | 0,5 mm |
| kasabaran Soldermask: | +\-0,5 mm |
| Toleransi diménsi routing minimum: | +\-0,5 mm |
| Permukaan rengse: | HASL, LF HASL, Immersion Silver, Immersion Emas, Flash Emas, OSP |
| Wangun: | Punching, laser, motong |
| Parabot: | Universal Tester |
| Ngalayang usik Buka / Tester pondok | |
| Mikroskop kakuatan tinggi | |
| Kit Tés Solderability | |
| Tester Kakuatan mesek | |
| High Volt Buka & Short tester | |
| Cross Bagian Molding Kit Jeung Polisher | |
| Kapasitas kaku & lentur | |
| Lapisan: | 1-28 lapisan |
| Jenis bahan: | FR-4 (Tinggi Tg, Halogén Gratis, Frékuénsi Luhur) |
| PTFE, BT, Getek, Aluminium base，Basa tambaga，KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon | |
| Ketebalan papan: | 6-240mil / 0,15-6,0mm |
| Ketebalan tambaga: | 210um (6oz) pikeun lapisan jero 210um (6oz) pikeun lapisan luar |
| Min ukuran bor mékanis: | 0.2mm / 0.08" |
| Babandingan aspék: | 2:01 |
| Max ukuran panel: | Sigle sisi atawa sisi ganda: 500mm * 1200mm |
| Lapisan multilayer: 508mm X 610mm (20″ X 24″) | |
| Min lebar garis/spasi: | 0.076mm / 0.076mm (0.003″ / 0.003″)/ 3mil/3mil |
| Via tipe liang: | Buta / Dikubur / Dipasang (VOP, VIP…) |
| HDI / Mikrovia: | Enya |
| Permukaan rengse: | HASL, LF HASL |
| Immersion Emas, Flash Emas, ramo Emas | |
| Immersion Silver, Immersion Tin, OSP | |
| Selektif Emas Plating, ketebalan Emas nepi ka 3um (120u") | |
| Carbon Print, Peelable S/M, ENEPIG | |
| Wangun: | CNC, Punching, V-cut |
| Parabot: | Universal Tester |
| Ngalayang usik Buka / Tester pondok | |
| Mikroskop kakuatan tinggi | |
| Kit Tés Solderability | |
| Tester Kakuatan mesek | |
| High Volt Buka & Short tester | |
| Cross Bagian Molding Kit Jeung Polisher | |
waktos pos: Sep-05-2022
