Kapasitas pangiriman
| Kapashi Déwan Rigid | |
| Jumlah lapisan: | 1-42 |
| Materiel: | FR4 \ tinggi tg Fr4 fr4 \ pimpinan gratis \ cem1 \ cem3 \ aluminium |
| Kaluar lapisan cukuran cu: | 1-6oz |
| Batin sareng ketebalan cu | 1-4oz |
| Wewengkon ngolah maksimum: | 610 * 1100mm |
| Kebar pangeda minimum: | 2 lapisan 0.3mm (12mil) 4 Lapisan 0.4mm (16mil) 6 lapisan 0.8mm (32mil) 8 lapisan 1.0mm (40mil) 10 lapisan 1.1mm (44mil) 12 lapisan 1.3mm (52mil) 14 lapisan 1.5mm (59mil) 16 lapisan 1.6mm (63mil) |
| Lebar minimum: | 0.076mm (3mil) |
| Ruang minimum: | 0.076mm (3mil) |
| Ukuran liang minimum (liang akhir): | 0.2mm |
| Rasio Aspék: | 10: 1 |
| Ukuran liang jalan: | 0.2-0.65mm |
| Kasalahan Rocing: | \ \ - 0,05mm (2mil) |
| The reverse Ph | Φ0.2-1.6mm + (0,075mm (3mil) Φ1.61.3mm + \ - 0.1mm (4mil) |
| Kasabaran npth: | Φ0.2-1.6mm + \ - 0,05mm (2mil) Φ1.6.3mm + \ - 0,05mm (2mil) |
| Rengse kasaburasan ieu: | Ketebalan <0.8mm, kasabaran: +/- 0,08mm |
| 0,8mmmicknessness.5mm, kasabaran +/- 10% | |
| Jambatan Minimum Minimum: | 0.076mm (3mil) |
| Tulisan sareng Bending: | ≤0.75% min0.5% |
| Raneg of tg: | 130-215 ℃ |
| Kasabaran impedance: | +/- 10%, min + 1 5% |
| Perawatan permukaan:
| Hasl, lf hasl |
| Sayunkeun emas, lampu kilat emas, ramo emas | |
| Pérak Pérak, TIFS Sumefer, ISP | |
| Pengingak emas pilih, ketebalan emas dugi ka 3um (120u ")) | |
| Cetak karbon, dikapas s / m, Inpepig | |
| Kapasitas dewan aluminium | |
| Jumlah lapisan: | Lapisan tunggal, lapisan ganda |
| Ukuran dewan maksimum: | 1500 * 600mm |
| Papan ketebalan: | 0.5-3.0mm |
| Kecepatan tambaga: | 0,5-4oz |
| Ukuran liang minimum: | 0,8mm |
| Lebar minimum: | 0.1mm |
| Ruang minimum: | 0.12mm |
| Ukuran pad ukuran: | 10 Myron |
| Rengse | Hiber, esti |
| Bentuk: | Cnc, ditumbuk, v-cut |
| Panapan: | Tés universal |
| Ngalayang Probe Buka / Tester pondok | |
| Mikroskop kakuatan tinggi | |
| Tés Kiting Kit | |
| Korsi listrik | |
| Jenis Volt Buka & Tester pondok | |
| Cross bagian ngintunkeun kit kalayan polder | |
| Kapasitas fPC | |
| Lapisan: | 1-8 lapisan |
| Papan ketebalan: | 0,05-0.5mm |
| Kecepatan tambaga: | 0,5-3oz |
| Lebar minimum: | 0,075mm |
| Ruang minimum: | 0,075mm |
| Dina ukuran liang: | 0.2mm |
| Ukuran liang laser minimum: | 0,075mm |
| Ukuran liang jalan minimum: | 0,5mm |
| Heranan soldermask: | + \ - 0.5mm |
| Kaserang diménsi minimal | + \ - 0.5mm |
| Rengse | Hibl, lf hasl, imlerdlex, immer emas, Emas Emas, ot |
| Bentuk: | Ditumbuk, laser, motong |
| Panapan: | Tés universal |
| Ngalayang Probe Buka / Tester pondok | |
| Mikroskop kakuatan tinggi | |
| Tés Kiting Kit | |
| Korsi listrik | |
| Jenis Volt Buka & Tester pondok | |
| Cross bagian ngintunkeun kit kalayan polder | |
| RIGID & KHAS FLACL | |
| Lapisan: | 1-28 lapisan |
| Jenis bahan: | Fr-4 (tg tinggi, Halogen gratis, frekuensi tinggi) PTFE, BT, Getek, Aluminium base，Copper base，KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon |
| Papan ketebalan: | 6-240mill / 0.1510-0mm |
| Kecepatan tambaga: | 210an (6oz) pikeun lapisan batin 210 (6oz) pikeun lapisan luar |
| Ukuran bor mékanis: | 0.2mm / 0,08 " |
| Rasio Aspék: | 2: 1 |
| Ukuran panel max: | Sigle sisi atanapi ganda ganda: 500mm * 1200mm |
| Lapisan Multilayer: 508mm x 610mm (20 "x 24") | |
| Min Lebar / Spasi: | 0.076mm / 0,076mm (0.003 "/ 0.003") / 3MIL / 3MIL |
| Via jinis liang: | Buta / dikubur / dipasang (vop, vip ...) |
| HDI / mikrovia: | Nuhun |
| Rengse | Hasl, lf hasl |
| Sayunkeun emas, lampu kilat emas, ramo emas | |
| Pérak Pérak, TIFS Sumefer, ISP | |
| Pengingak emas pilih, ketebalan emas dugi ka 3um (120u ")) | |
| Cetak karbon, dikapas s / m, Inpepig | |
| Bentuk: | Cnc, ditumbuk, v-cut |
| Panapan: | Tés universal |
| Ngalayang Probe Buka / Tester pondok | |
| Mikroskop kakuatan tinggi | |
| Tés Kiting Kit | |
| Korsi listrik | |
| Jenis Volt Buka & Tester pondok | |
| Cross bagian ngintunkeun kit kalayan polder | |
